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conga-TM67 (EOL)
高性能COM Express Basic Type 6模块, 支持英特尔®酷睿™i7处理器
- 高性能COM Express Basic Type 6模块
- 最高支持英特尔®酷睿™i7四核处理器
- 热管散热解决方案
Specification
Low Power Intel® Core™ i7 2.2GHz processor
Documents
Manual
Data Sheet
Application Note
Image
Software
Product Variants
Ecosystem Details
Cooling Solutions
Standard heatspreader for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard active cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express Type 6 modules conga-TM67 and conga-TM77 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
Accessories
conga-FPA2 (EOL)
通用平板配置器
conga-LDVI
适用于LVDS的DVI转换模块
conga-TEVAL/COMe 2.1 (EOL)
COM Express Type 6模块评估载板