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conga-BP77 (EOL)
COM Express™ Basic Type 2模块 基于第三代英特尔®酷睿™处理器家族
- 最高性能的COM Express Type 2模块
- 基于第3代英特尔®酷睿™处理器平台
- 更佳的高清转码,高请视频会议
- 增強图形性能,支持DirectX®11
Specification
Intel® Flexible Display Interface (FDI), Intel® Dynamic Video Memory Technology (Intel® DVMT) OpenGL 3.1 and DirectX11 support. Three independent pipelines provide support for three independent displays (must be 2 DisplayPort plus any other display).
It is capable of calculating efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 3.0 compliant, Smart Battery Management
Operating: 0 to +60°C Storage: -20 to +80°C
Documents
Manual
Application Note
Image
Data Sheet
Software
Use for BIOS update or customization and panel configuration. Linux source version.
Important note: Only compatible with cgos 1.03.032 and older!
Product Variants
Ecosystem Details
Cooling Solutions
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height and integrated 12V fan. All stand-offs are M2.5mm threaded.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All stand-offs are M2.5mm threaded.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express module conga-BS67, conga-BS77 and conga-BP77 with integrated heat pipes. All stand-offs are M2.5mm threaded.
Memory
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM.
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM.
DDR3L SODIMM memory module with 1600MT/s (PC3L-12800S) and 2GB RAM.
Accessories
conga-CKIT (EOL)
该完整套件能够立即对COM Express™ Type 2模块进行评估.
conga-CEVAL (EOL)
基於Type2引脚定义的COM Express 评估载板
conga-Cdebug (EOL)
适用于COM Express Type 2及其载板的调试平台
conga-FPA2 (EOL)
通用平板配置器
conga-LDVI
适用于LVDS的DVI转换模块