conga-TEVAL3/COMe3.1

Board Type

• Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.1

Internal IO

• PCIe Gen4 x16 (PEG)
• PCIe Gen4 x4
• 2x PCIe Gen4 x1
• M.2 Key B 2242/3042 (USB2.0 muxed, PCIe x1, SIM)
• M.2 Key E 2230 (USB2.0 muxed, PCIe x1)
• Dual USB2.0 header (muxed)
• USB Typ B (muxed)
• 3x SATA 6Gb/s
• SATA 6Gb/s with SATADOM Pin 7
• LVDS (muxed with eDP)
• eDP (muxed with LVDS)
• VGA Dsub
• HDA/SoundWire header
• GSPI header
• SD Card socket (muxed with GPIOs)
• SPI boot flash socket
• Up to 4x COM headers
• CAN header
• LPC header
• Feature Connector
• ATX-4pin Power connector
• ATX-24pin Power connector
• Banana sockets for single power input

External IO

• RJ45 2.5G Base-T
• 2x Dual USB Type A up to 10Gbps
• 2x USB4 Type C up to 20Gbps with Intel® JHL9040RIT Thunderbolt™ 4 Retimer
• DP++ HBR3
• 2x Audio Jack 3.5mm

Temperature
Operation -40°C to 85°C | Storage -40°C to 85°C

Humidity
Operation 10% to 90% r. H. non cond. | Storage 5% to 95% r. H. non cond.

Size
294 x 244 mm²

Carrierboards

conga-TEVAL3/COMe3.1 (P/N 065820)

congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C