Deggendorf, Germany, July 2nd, 2012 *** congatec AG, a leading manufacturer of embedded computer modules, releases the conga-TS77 which supports the latest 3rd generation Intel® Core™ processor variants and the new Mobile Intel QM77 chipset. The Type 6 COM Express module offers more performance, improved energy efficiency, greater security thanks to Intel® VT (Intel® Virtualization Technology) and optional Intel® AMT (Intel® Active Management Technology) 8.0 support.
The conga-TS77 is immediately available with support for the Intel® Core™ i7-3555LE (2.50 GHz, 4 MB Intel® Smart Cache, 25W), Intel® Core™ i7-3517UE (1.7 GHz, 4 MB Intel® Smart Cache , 17 W) and Intel® Core™ i5-3610ME (2.7 GHz, 3 MB Intel® Smart Cache, 35W) processors.
The key innovations of the 3rd generation Intel® Core™ processors include use of 3D tri-gate transistors, 22-nanometer manufacturing and tighter integration of the graphics core. The module also features support for up to 16GB of fast dual-channel DDR3 memory (1600 MHz) and native USB 3.0.
Intel® AMT 8.0 enables remote PC maintenance, display of status information, modification of configurations and switching the PC on and off. Serial Over LAN (SOL) handles the forwarding or redirection of input/output devices. Thanks to these features it is possible to manage, inventorize, diagnose and repair PCs even if the system has been disconnected, the operating system has crashed or the hard drive is defective.
The integrated virtualization technology, Intel VT®, allows the creation of an isolated environment outside of the actual PC operating system in order to manage security threats from the network. In conjunction with the AMT functions, infected PCs can be isolated remotely from the network before the infection spreads further.
The COM Express module has seven PCI Express 2.0 lanes, PCI Express Graphics 3.0 (PEG) x16 lanes for high-performance external graphics cards, four SATA ports supporting up to 6Gb/s, RAID support, plus a Gigabit Ethernet interface allowing fast and flexible system expansion. Fan control, LPC bus for easy integration of legacy I/O interfaces, and Intel® High Definition Audio complete the feature set.
