Archived Press Releases

提供更多解决方案, 最大限度提升OEM价值

专为恶劣环境设计,具备出色的抗震性和抗冲击性

The target: holistic consolidation and digitization offerings

超低功耗封装的高端边缘AI和视觉处理

专为恶劣环境设计,具备出色的抗振动性和抗冲击性

小尺寸模块使高性能生态系统更加完整

目标:降低NRE成本,加快上市时间,改善产品和供货保障

打造基于ARM架构的SMARC模块高性能生态系统

Seoul, Korea / Taipei City, Taiwan, March 2, 2023 * * * congatec – a leading vendor of embedded and edge computing technology – will be presenting its enhanced high-performance landscape for edge…

Deggendorf, Germany, 3 February, 2023 * * * We would like to inform you that Mr. Gerhard Edi, Managing Director and Chief Strategy Officer, is leaving the Management Board of the congatec group with…

高端嵌入式计算机喜迎新年:全球最快的客户端计算机模块面世

Healthcare and the cloud: secunet medical connect securely links medical devices and networks

模块化高端Micro-ATX载板提供更高可持续性和可扩展性的COM-HPC系统设计

获奖关键: 康佳特支持客户对应巨大的商业挑战和技术变革

康佳特模块助力面向研究和教育的英特尔中国研究院机器人4.0平台

康佳特扩展基于第12代英特尔酷睿处理器的COM-HPC和COM Express计算机模块 新增七款更高能效的新处理器

康佳特推出五款新COM-HPC Server Size D模块,搭载遵循“紧凑高效”理念的英特尔至强D-2700处理器

Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

Arm Project Cassini完成:采用NXP i.MX 8M Plus处理器的康佳特模块已获得Arm SystemReady IR认证

congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

Embedded computing engines that put smart vehicle developers into the fast lane

First joint project: Edge computer for mobile intralogistics

Focus on OEM platforms for regulated industries

康佳特推出三款采用英特尔至强D处理器的新服务器模块系列

德克 哈夫特 (Dirk Haft)博士担任新CEO, 丹尼尔·尤尔根斯 (Daniel Jürgens)担任新CFO

计算机模块满足功能安全和安保要求

congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

Virtually latency free vision with up to 226.5 FPS

基于i.MX 8M Plus的康佳特模块使Qseven的设计在未来获得巨大的性能提升

神经处理单元(NPU)加速智能视觉应用

congatec announces the foundation of congatec Korea Ltd.

康佳特聚焦全球最大的医疗经济体

用于嵌入式视觉和AI应用的低功耗旗舰产品

让低功耗全天运行系统具备更强性能

针对边缘计算更宽广的工作温度范围——从高端COM-HPC到低功耗SMARC

基于第11代英特尔酷睿处理器的新康佳特模块 面向户外和车内应用

康佳特扩展解决方案平台 面向加固型雾计算市场

康佳特首款基于AMD 锐龙™ 嵌入式 V2000处理器 COM Express Compact模块

康佳特推出COM-HPC新生态系统

SCHURTER adds world-leading computer module vendor to its line card

Continuity in innovation for an ever-changing world

康佳特推出基于英特尔凌动® x6000E系列处理器的五种模块

康佳特助力英特尔®第11代酷睿™处理器的发布 推出两款全新设计选择

Leveraging synergies to increase customer benefits

尺寸优化的康佳特SMARC2.1载板 助力基于英特尔凌动处理器的3.5英寸单板模块化

Dear Valued Customer,

As an immediate reaction to the current situation related to the spread of Covid-19 ("Corona Virus"), we decided to take the responsibility for our employees and…

面向嵌入式视觉和边缘的高速连接

康佳特推出面向NXP i.MX8处理器的3.5英寸载板新品

独立测试证实了康佳特3.5英寸单板计算机(SBC)的卓越性能

congatec to focus on embedded edge computing at Embedded World

Deggendorf, Germany, 24 September, 2019 * * *  congatec – a leading supplier of standardized and customized embedded computer boards and modules – has appointed Thomas Schultze as new member of the…

发掘COM Express Type 7服务器的最大性能

 

A new rugged class of data processing engines for the digitization of the oil and gas industry

Next generation embedded vision computing in three different flavors at Japan IoT/M2M Expo

评估最新NXP i.MX 8 QuadMax处理器的最佳利器

康佳特首次提升40%性能表现

搭载商用BGA处理器的 高品质嵌入式板 - 开启新应用领域 - 支持快速入市战略

congatec growth faster than the market

congatec drives sales by broadening its market reach

More processing power for connected aircrafts, in-flight infotainment and augmented reality in aviation

2- 4瓦低功耗应用的新基准

嵌入式计算与视觉技术的融合

最新经济高效入门级平台面向高端嵌入式运算

Record revenue and increasing investments in sales and technical services further propel growth

可灵活运用的一流ARM处理器

congatec simplifies integration of smart vision at transportation checkpoints

康佳特助力嵌入式市场采用实时管理程序

全新AMD Ryzen Embedded处理器

提供比竞争对手 高出3倍的GPU性能

适用于IIoT边缘的视频分析随即可用工具包

 

congatec enables cost-efficient 10GbE edge server designs

一板多用: 嵌入式主板面向所有高端应用

值得信赖的团队: 康佳特ETX/XTX模块与AMD Geode

congatec expands French sales partner network

congatec presents virtualized fog server installation

支持10GbE带宽的新康佳特模块提升嵌入式边缘处理性能

康佳特开始推动工业市场转型到10GbE带宽

Hannover Declaration of close cooperation shows first results

congatec again pushes standardization to boost design efficiency

康佳特Type7 服务器模块符合PICMG标准

康佳特进一步标准化SMARC2.0接口设置

congatec’s latest OS implementation further simplifies development of IoT-connected devices

首款名片大小兼具完美功能的COM Express 模块

congatec strives to become embedded go-to provider in France

Martin C. Frederiksen joins congatec as Sales Director for Northern Europe

30% more processing power and 45% more graphics performance in 100% industrial-grade congatec quality

Everything you need for the evaluation of SMARC 2.0 and the new Intel® Atom™ low power processors (Apollo Lake)

一款为入门级的最佳选择,另一款为高端的完美选择

全新规格尺寸搭载全新低功耗处理器

可轻松定制, 现场快速布署

Yasuyuki Tanaka joins congatec as Country Manager Japan

SMARC 2.0: 介于Qseven 与COM Express 之间的完美补充解决方案

congatec introduces new Server-on-Modules with high transcoding performance based on the latest Intel® Xeon® processors

congatec integrates today’s most cost efficient Intel® Celeron® processor with fast DDR4 SO-DIMM memory support

New congatec COM Express module with Intel® Xeon® processor and Intel® Iris™ Pro graphics

New conga-TR3 module based on AMD G-Series SOC offers up to 30% more graphics performance and fast DDR4 RAM

congatec appoints Technagon as sales technology partner

congatec fully supports the upcoming new SGET and PICMG Computer-on-Module specifications

congatec launches price-breaking boards and modules with the Intel® Atom™ x5-E8000 processor

 

康佳特模块搭载AMD Geode LX 800处理器 将持续供货至2019年底

congatec appoints Fred Barden as Vice President, Worldwide Sales

 

丰富活泼的SOC图形芯片,全面支持HSA 1.0

及12瓦高性能低功耗表现

康佳特全新COM Express 模块实现服务器等级嵌入式性能

Enhanced computing and graphics performance for credit card sized computer modules

康佳特推出基于飞思卡尔i.MX 6 的µQseven模块 助力小型化趋势的发展

全新旗舰级低功耗模块

支持最高3个独立显示与4K分辨率

 

投资新研发设备与人才协助及驱动亚洲市场的成长

Jason Carlson出任首席执行官, 同时担任首席技术官的Gerhard Edi, 以及任职首席财务官和首席营运官的Josef Wenzl, Matthias Klein作为支持团队

Graphics-rich low-power Mini-ITX boards with SoC integrated AMD Radeon graphics and configurable TDP for industrial-grade system designs

First congatec COM Express module to deliver server-grade performance for demanding graphics applications

于2015台北国际电脑展COMPUTEX 2015, 康佳特将在南港展览馆 1F 展位号K1015 展示最新创新产品

conga-QA4支持更低功耗,更高处理能力且搭载最新集成英特尔®Gen8图形处理器

Deggendorf, Germany, April 28th, 2015 * * * congatec AG, a leading technology company for embedded computer modules, single board computers and EDM services is pleased to announce that the conga-MA3…

congatec maintains its position as the number one vendor

for Computer-on-Modules in EMEA

Industrial single board computer based on Intel® Atom™ E3800 processor series (code named Bay Trail)

 

embedded world, Nuremberg, 24 February 2015   *  *  *   congatec AG, a leading technology company for embedded computer modules, single board computers and EDM services, has released a Qseven IoT kit…

Qseven, COM Express, XTX and ETX Computer-on-Modules with AMD Embedded G Series SoC now with 10 years long-term availability instead of 7 years

Deggendorf, Germany, 5 January 2015   * * * 具备领先科技的嵌入式计算机模块,单板计算机与EDMS定制化服务领导厂商-德国康佳特科技,扩展其成功的模块产品领域,推出基于第五代英特尔®酷睿™处理器平台的COMExpress 计算机模块和Thin Mini-ITX主板,支持最高达英特尔®酷睿™i7-5650U。该单芯片处理器之最高TDP仅15瓦的低功耗。

基…

At this year's Embedded World, congatec will present a wide range of innovations in Hall 1, Stand 358. Next to the conga-TC97 COM Express board, the company will also show the new Mini-ITX board conga-IC97

具备领先科技的嵌入式计算机模块,单板计算机与EDMS定制化服务领导厂商-德国康佳特科技,扩展其成功的模块产品领域,推出首款工业级超薄Mini-ITX主版。conga-IC87 Mini-ITX主版基于第四代酷睿单芯片处理器 (代号Haswell) ,具备最高TDP仅15瓦的低功耗和7年以上的供货期。 

         …

康佳特全新EDMS(Embedded Design & Manufacturing Service)定制化服务支持客户完整的产品生命周期开发

congatec evolves from start-up to EMEA market leader for Computer-on-Modules in just a decade

Shanghai, December 8, 2014   * * *  具备领先科技的嵌入式计算机模块,单板计算机和EDM服务领导厂商-德国康佳特科技, 在其成功的Qseven产品系列中推出第一款"Headless" 计算机模块。

 

congatec Qseven Headless 模块基于全新英特尔® 凌动™ 处理器 E3805( 1M高 速缓存,1.33 GHz, 3WT…

Munich, electronica, November 11, 2014   * * *  congatec AG, a leading technology company for embedded computer modules, single board computers and EDM services, is expanding its successful product…

Munich, electronica, November 11, 2014   * * *  congatec AG has entered into a distribution agreement with ies GmbH & Co. KG for the German speaking market. A specialist in intelligent embedded…

conga-MA3E搭载英特尔®凌动™E3800系列, 表贴ECC内存功能提供最高可靠性

Deggendorf, Germany, October 07, 2014 * * * congatec AG, a leading technology and ODM company for embedded computer modules and single board computers, announces the appointment of Mr. Sajith Kandiyil…

Deggendorf, Germany, 1 September 2014 * * * congatec AG, a leading technology company for embedded computer modules, single board computers and ODM designs, announces the appointment of Neil Wood as…

Deggendorf, Germany, 13 August 2014 * * * 具备领先科技和ODM服务的嵌入式计算机模块与单板计算机领导厂商-德国康佳特,正式宣布与Eltech成为合作伙伴,Eltech在俄罗斯及邻近独立国家联合体(C.I.S.)区域是主要的电子元件及模块经销商。此合作伙伴关系将显著强化康佳特在此区域为计算机模块领导供应商的地位。

藉着Eltech和康佳特签订合作伙伴关系,在俄…

Deggendorf, Germany, 25 August 2014 * * * congatec AG announces the appointment of Matthias Klein as Chief Operating Officer (COO) and member of the Executive Board.


Matthias Klein, who has worked as…

康佳特中国办公室座落在世界商业中心上海

基于 AMD第二代嵌入式G系列SOC "Steppe Eagle" 处理器的最新Qseven和COM Express计算机模块提高每瓦性能且更低功耗

COMPUTEX, Taipei, Taiwan, 4 June 2014  * * *  康佳特科技- 嵌入式计算机模块及工业主板原始设计制造之技术领导厂商,宣布基于英特尔®凌动™处理器E3800家族的conga-QA3 Qseven模块产品正式被认证为适用于物联网英特尔® 网关解决方案。

康佳特将其嵌入式计算机模块产品与经英特尔,风河(Wind…

conga-TS87 COM Express Type 6 basic module: Unprecedented vector processing, floating point and graphics performance with no increase in power draw

康佳特跨入基于AMD嵌入式G系列SOC平台的工业级Mini-ITX主板市场

Deggendorf, Germany, 13 May 2014  * * *  congatec AG, a leading manufacturer of embedded computer modules, announces that the company is diversifying to ensure continued annual growth of more than 20%…

The no. 2 computer-on-module supplier worldwide now ranks no. 1 in EMEA according to IHS

The new Yocto project is establishing itself as the Embedded Linux Operating System and is now available on Qseven conga-QMX6

Embedded World, 25 February 2014 * * * congatec AG, a leading manufacturer of embedded computer modules, announces its first COM Express Mini Type 10 module with a size of 55 x 84 mm and based on the…

The conga-QG requires 33% less power than previous module with AMD G-Series and offers optimized graphics performance

 

"Take the most out of Computer-On-Modules" is the congatec motto at embedded world in Nuremberg (February 25th to 27th, 2014), to which we would like to invite you.

The registration for free…

New Regional Sales Manager to drive growth in Russia and CIS

The conga-QA3 provides twice the performance over its predecessor plus an optimized product lifespan thanks to development with ceramic condensators

Deggendorf, Germany, 8 October 2013  * * * congatec AG, a leading manufacturer of embedded computer modules, announces the release of the conga-TCA3 COM Express module. The conga-TCA3 is available in…

The low-cost COM Express Type 6 module conga-TS87/i3-4102E is scalable up to the quad-core Intel® Core™ i7

The congatec conga-TC87 COM Express compact module is equipped with the new embedded processors of the Intel® Core™ U-Series. Despite offering greater performance, the maximum thermal design power is only 15 watts.

Deggendorf, Germany, 1 August 2013 * * * congatec AG, a leading manufacturer of embedded computer modules, has entered into a partnership with MCTX Mobile & Embedded Computers GmbH effective 1st of…

congatec donates 52,000 Euro to the victims of the devastating floods to hit company HQ town

With sales of 60.6 million euros and 2.5 million euros in EBIT, congatec strengthens its position as the world’s number two player in Computer-on-Modules

 

conga-TS87 COM Express Type 6 Basic 基本型模块:无可比拟的矢量处理、浮点和图形能力并且不因此增加能耗。

Full design-in includes Qseven Starter Kit, WEC7 software support, Linux BSP and tablet PC demonstrator

Deggendorf, Germany, 23 May 2013   * * *   congatec AG, a leading manufacturer of embedded computer modules, is partnering with Tritech Solutions AB in Sweden. Tritech is an expert in the development…

Based on the AMD Embedded G-Series SOC, the new conga-TCG combines compact design with improved graphics performance and power efficiency

embedded world, Nuremberg, 26 February 2013  * * *  congatec AG, a leading manufacturer of embedded computer modules, presents the Qseven Mobility Kit, a complete starter package for the rapid…

The Latest High-Performance, Low-Power Computer-On-Modules Enable Simpler, Faster and More Flexible Designs

embedded world, Nuremberg, 26 February 2013   * * *   congatec AG, a leading manufacturer of embedded computer modules, is partnering with Prevas to drive sales and innovation in Sweden, Norway and…

embedded world, Nuremberg, 26 February 2013 *** congatec AG, a leading manufacturer of embedded computer modules, announces a Windows® Embedded Compact 7 version of the conga-QMX6 Qseven module based…

Deggendorf, Germany, 20 February 2013 *** congatec AG, a leading manufacturer of embedded computer modules, introduces Intel® Celeron ® Dual-Core processors  with 3rd Generation Intel® Core™…

With 293 percent growth, congatec takes 22nd place in Deloitte Technology Fast 50 rankings for 2012

The COM Express reference board offers a quick route to customized video wall system development and speeds time-to-market

Type 2 or Type 6 Pin-out – congatec has the appropriate graphics options for either

Munich, electronica, 13. November 2012   * * *  congatec AG, a leading manufacturer of embedded computer modules, has entered into partnership with Adeneo Embedded to deliver ready-to-use board…

Munich, electronica, 13 November 2012  * * *  congatec AG, a leading manufacturer of embedded computer modules, announces a new Qseven Starter Kit providing developers with a complete package to…

Deggendorf, Germany, 6 November 2012  * * *  congatec AG, a leading manufacturer of embedded computer modules, has announced its cooperation with Ineltro Halmer Electronics GmbH, headquartered in…

San Diego, California – September 12, 2012 – congatec, Inc., a leading manufacturer of embedded computer modules announced today it has inked a distribution agreement with Avnet Embedded, a division…

Deggendorf, Germany, 10 September 2012  * * *  congatec AG, a leading manufacturer of embedded computer modules, is widening its sales presence in Australia and New Zealand with the opening of a new…

Deggendorf, Germany, 9 August 2012  * * * congatec AG, a leading manufacturer of embedded computer modules, officially opened a Japanese subsidiary in Tokyo on 1 July 2012. Eric Hsu has been appointed…

Increased computing performance with concurrent improvement in energy efficiency on pin-out Type 2 with PCI Express graphics (PEG) support

Deggendorf, Germany, July 2nd, 2012 *** congatec AG, a leading manufacturer of embedded computer modules, releases the conga-TS77 which supports the latest 3rd generation Intel® Core™ processor…

Statutes, objectives and regulations now available for download from SGET website

conga-TFS offers superb integrated graphics performance along with an excellent performance-per-watt ratio for demanding applications

conga-TM77: increased computing performance with improved energy efficiency

The conga-QMX6 runs on Freescale’s new i.MX6 ARM Cortex A9 processors; it’s trump cards include broad scalability, long-term availability, an extended temperature range and, above all, low power dissipation of less than 5W

Nuremberg, Embedded World, 28 February 2012  * * *  congatec AG, a leading manufacturer of embedded computer modules, announces a new cooling system based on cooling pipes which are integrated in…

The conga-TCA offers lower power consumption and significantly improved graphics performance

The new Standardization Group for Embedded Technologies (SGET) is on its way

Computer modules from congatec with AMD Fusion technology provide OpenCL support for ETX, XTX, COM Express and Qseven standards

conga-TS67 supports low-power Intel® processors including the Celeron® 807UE (1M Cache, 1.0 GHz) with just 10 Watt TDP

Growth of 1396% puts congatec in leading position in the Deloitte Technology Fast 50 2011

Cooperation with Freescale broadens future selection

of Computer-on- Modules

The new conga TM67 is based on the Type 6 Pin-out and supports the Intel® i7-2710QE Quad-core processor (2.1 GHz, 45W, PGA) and others

Nuremberg, SPS/IPC/Drives, 22 November 2011 * * *   congatec AG, a leading manufacturer of embedded computer modules, presents the conga-QMCB, a new mini carrier baseboard for space-critical…

拥有卓越图形处理效能及双核心效能的conga-QAF Qseven模块在便携式应用上更加得心应手

AMD Fusion architecture guarantees best price/performance ratio

德国纽伦堡,Embedded World, 2011年3月2日* * *  嵌入式计算器模块领导厂商德商康佳特,推出適用於COMExpress Type2 Compact小型模块的袖珍载板conga-MCB, 相当适合空间受限的应用。它非常适合用于快速原型的建构,但也可适用于高性能的移动式应用。

这极易集成的微型載板只有145×…

Deggendorf / Germany, April 11, 2011   * * *   congatec AG announces a collaboration with Avnet Embedded to serve the industrial market in UK, Nordic and Baltic with congatec’s Computer-On-Modules.…

德国Deggendorf,2011年4月4日*** 嵌入式计算器模块领导厂商德商康佳特,再度以2010年度总营收四千五百六十万欧元(约四亿二千六百万人民币) 刷新该公司纪录。 专注于嵌入式计算器模块及配件销售的成果下,2010年比前年2009年二千六百万欧元增长了75% !


“透过包含各地销售伙伴及直接销售,不断地开发扩展多重销售管道的分销策略得到回报 “康佳特执行长Gerhard…

conga-CA6提供低功耗且有令人惊艳的图像效能表现,甚至在宽温范围下 !

结合AMD Fusion技术与ETX和XTX的一个完美形式,功能搭配

conga-BAF 提供杰出的图像效能并同时拥有低功耗的优势

New conga-BM67 delivers with the Intel® CoreTM i7-2710QE processor (2.1 GHz, 45W, PGA), one of Intel's latest mobile quad-core processors supported for the embedded market

康佳特展开它的Qseven产品组合 - 全新移动式计算机模块,提供增强的图形效能并且支持宽温

慕尼黑,德国 Electronica  2010年11月 * * *  德商康佳特,  嵌入式计算机模块领导制造商,宣布在现有conga-BM45和conga-BM57 COM Express Type 2模块上支持最高达3个 Display Port 的图像接口


DisplayPort是一个完全数字化,基于封包…

新产品 conga-BE57(95x125mm)拥有内存侦错修正这项特色,能确保最大的可靠性

Embedded Building Blocks initiative facilitates embedded solutions for SMEs

Nuremberg, Germany, SPS/IPC/DRIVES, November 23, 2010   * * * congatec AG, a leading manufacturer of embedded computer modules, announces CAN (Controller Area Network) bus support on the conga-QA6…

Nuremberg, Germany, SPS/IPC/DRIVES, November 23, 2010   * * * congatec AG, a leading manufacturer of embedded computer modules, presents the first Qseven Starter Kit for automation. Low power…

2010 sales increase by 86% compared to last year

Lars Hallberg has been appointed Territory Manager for the Nordic region

总营收增加至一千八百九十万欧元(约一亿六千万人民币) !

San Diego, California, and Toronto, Ontario August 23, 2010   * * *   Connect Tech and congatec announced today that Connect Tech has based the design of its latest PCI/104-Express Single Board…

Bob Pickles has been appointed Business Development Manager for the new UK office

 

The new conga-BS57 (95 x 125 mm) provides maximum computing power and graphics performance combined with lower power consumption

conga-CS45, conga-BS45 and conga-BM45 provide interchangeability and great scalability for all applications

Deggendorf, Germany, March 30th, 2010 * * *   congatec AG announces the appointment of Axel Petrak to the Executive Board where he will be representing Sales and Marketing with immediate effect.…

Deggendorf, January 26, 2010  * * *   congatec AG, a leading supplier of embedded computer modules, has announced that Christian Eder will be taking on the position of Sales Manager EMEA with…

New conga-BM57 delivers maximum computing performance paired with highest graphics speed from the integrated graphics controller

German manufacturer of COM Express, XTX, ETX and Qseven Computer-On-Modules was launched on the 1st of January, 2005

Nuremberg, Germany, SPS/IPC/Drives,  24 November 2009   * * *    congatec AG will be presenting a starter kit for APIX technology at SPS/IPC/Drives. APIX was originally developed for transferring…

德国纽伦堡国际电器自动化系统及组件展览会 SPS/IPC/DRIVES

2009年11月24日~ 26日 , 摊位: Hall 8, stand 228

 

德商 康佳特获得英特尔渠道伙伴(Channel Partner Program)

最高等级Premier 会员资格

 

2009 1118Deggendorf,  德国* * *

Orders for current financial year up by 30 % compared to previous year

Deggendorf, Germany, 22 September 2009   * * *   congatec AG, a leading supplier of embedded computer modules, has appointed Axel Petrak as its new International Sales and Business Development…

康佳特展出 Qseven可携式移动嵌入应用的开发工具包

德国,慕尼黑, Small Form Factor Boards Conference, 23rd July, 2009

  * * *   德商康佳特展出Qseven 可携式移动应用开发工具包。此套件为一完备、速成原型套装之电池供电的嵌入式系统。

小巧又低功耗的 QSeven…

Deggendorf, Germany, 23 July 2009  * * * congatec AG announces that Technofonds Bayern (The Bavarian Technology Fund) of Bayern Kapital GmbH (Bavaria Capital) intends to increase its holding in the …

Combining the Intel® Atom™ Processor N270 with the mobile Intel® 945GME Express chipset makes for powerful graphics performance

Deggendorf, May 29th, 2009   * * *   congatec AG, a leading provider of embedded computer modules, announced that the company has been elevated from Affiliate to Associate status in the Intel®…

The world’s best end-to-end manufacturing services provider has joined the Qseven standard thereby ensuring the long-term

availability of MXM connectors

Version 1.0 of the design specification has been completed under the auspices of congatec AG

Deggendorf, Germany, March 31, 2009   * * *   congatec AG, a leading supplier of embedded computer modules headquartered in Deggendorf, Germany, announces that the company will be further extending…

The new compact COM Express™ compatible module is specified for the full industrial temperature range.

The starter kit consists of both hardware and software as a design basis for PLC manufacturers

Embedded specialist is confident for the future, despite economic crisis



英特尔最新的凌动处理器大大地降低了计算器的功耗,由此计算器能满足整个新的应用。


    以下的文章说明康佳特的conga-IVI…

congatec AG presents its fourth embedded computer module based on the low power consuming Intel® Atom™ processor family.

 

第一个运用Qseven模块标准的产品且特别针对手持式设备市场

德国, 慕尼黑 electronica 展, 11月11日, 2008

德商康佳特发表 conga-QA, 第一个运用新的 Qseven 尺寸规范的电脑模块 ◦ conga-QA搭载英特尔最新凌动Z5xx 系列的处理器和英特尔 US15W 系统控制集线器 ◦

Qseven…

康佳特公司的散热技术简化了COM Express™, XTX™ and ETX® 的散热架构.

 

System solution hardware costs can be reduced by up to 50%

 

Munich, electronica, 11 November 2008   * * *   congatec AG announces a collaboration with leading systems service provider TQ (TQ-Systems / TQ-Components). The new partner will immediately begin…

First product based on the new Qseven module standard addresses the portable device market

Awards for young and successful companies from the three-country region that includes Eastern Bavaria, Upper Austria and Southern Bohemia

德商康佳特 conga-E855 搭配低耗电INTEL处理器 和 Intel® 855 芯片组

The Qseven™ Consortium reaches a total of 11 participating members

 

- 2007 sales revenue exceeded in the first half of 2008

- Sales revenue has increased by 162% in comparison to the previous year

 

conga-BM45搭载INTEL 45奈米 Core™ 2 Duo T9400 双核心处理器 , 支持 6MByte 缓存和高达 8Gbyte的DDR3内存

The Qseven™ Consortium publishes the official release of the Qseven embedded computer module specification

The Qseven™ Consortium reaches a total of 10 participating members

Rapid Growth in Europe and Asia Brings the Embedded Computer Board Manufacturer to U.S.

德国 Deggendorf , 2008年4月2号

德商康佳特科技发表了一款崭新的高效能低功耗 COM Express 系列产品Conga-CA

搭载Intel® Atom™ 處理器 Z500系列及英特爾SCH (System Controller Hub) US15W整合晶片.

Com Express 小型化计算器模块Compact…

德商congatecAG、意大利SECO、Portwell、IEI、MSC与Hectronic公布未来的新尺寸嵌入式计算器模块:Qseven

这项新的标准预期将使用最低电力芯片组之尖端科技技术有长期的可用性。

将目标针对于使用45nm奈米技术建构而成的新型嵌入性计算处理器,Qseven将可以补足这些处理器的低电力与小尺寸。借着开发企业最新处理器的嵌入性计算器,Qseven提供了高性能的计算器电…

Nuremberg, Embedded World, February 26, 2008   * * *  congatec AG, a leading innovator in embedded computing, has introduced conga-CMEN, the electronic industry’s first COM Express module based on…

工业计算机创新领导者- 德商康佳特推出智能电池模块 可支持各种COM Expess 嵌入式模块.

Featuring onboard DRAM and PCI-to-ISA bridge: conga-ELXeco is the rugged replacement for ISA based ETX® solutions

康佳特的conga-CKIT 为COM Express™工程应用的先端

An engineering head start is offered by the congatec COM Express™ starterkit

Data Modul has expanded its industrial product range to include Embedded Systems with an international cooperation agreement with congatec AG.

congatec AG Marketing Manager elected to be Draft Editor; Subcommittee to draft new “COM Express Carrier Design Guide”

The COM Express™ PnP initiative is pleased to welcome AAEON Technology Inc. as its latest member.

conga-X965: High Performance Graphics based on Intel® Core™ 2 Duo Processor and the Intel® Mobile Express Chipset GM965

COMPANIES UNITE AROUND COMMON DOCUMENTATION EASING COM EXPRESS DESIGNS

XTX carrier board with a rich set of features

The XTX Consortium is pleased to welcome AAEON and Fastwel as new participating members.

The new industrial computer for forklift and vehicle applications MPC 6 from DLoG features XTX embedded computer modules from congatec AG

conga-E855 is based on Intel® Pentium® M up to 1.8 GHz and supports the ISA bus

conga-X945/64: High Performance XTX Module based on Intel® Core® 2 Duo

conga-B945/64: High Performance COM Express Board with 64 Bit Dual Core Technology

conga-B945: High Performance COM Express Module with Intel Core Duo Technology and Dual Channel Memory Support

The XTX Consortium has released the XTX Specification Rev. 1.1

PLG AG is a new Solution Partner for congatec AG

conga-ELX is the ideal replacement for existing Geode-GX1 designs.

Advantech, Ampro and congatec, three leading embedded platform providers, announced today a new alliance to help promote the XTX standard for computer on modules.

An engineering head start is offered by the congatec XTX starterkit

As a result of its recent cooperative development agreement with congatec AG, SSV Embedded Systems is now offering custom development of the XTX module-based baseboards.

This year's embedded world exhibition marks the start of the cooperation of two industry specialists: SMA Technologie AG will provide custom baseboard solutions for congatec XTX modules. The advantages for the customer resulting from this close cooperation are obvious:

The customer will benefit from the know-how of two embedded computer technology specialists from one supplier, can always rely on solutions which integrate the latest technology and expect faster product development.

conga-X945: the first XTX module with dual core technology

congatec AG announces the conga-CLX, the first embedded computer module utilizing the miniaturized COM Express Compact standard

The conga-X915 supports all the features defined by the XTX standard

The Embedded Panel Interface EPI, an open standard, allows for easy and direct control of all flatpanel displays with maximum interchangeability.

Bosch Rexroth AG, congatec AG and two additional manufacturers of embedded computer modules have defined a miniaturized computer module based on the COM Express connector definition.

The conga-X845, the very first module based on the new XTX Standard, features the latest I/O interfaces and state of the art computing performance

The first public release of the XTX specification is now available.

Simulation of PCI Express signal path proves industrial usability of XTX

XTX consortium adds more members

Advantech, Evalue and MarekMicro

congatec AG is pleased to have aquired the services of Christian Schubert who is an experienced manager in the embedded computer industry.

American Megatrends will provide congatec AG, an embedded computer manufacturer, with AMIBIOS8 system software that will be integrated into all of its products

congatec's XTX™ extension boosts I/O performance to a factor of more than 10

conga-EVEGA is ETX® compatible and based on the STPC VEGA, with USB 2.0