Atlanta, USA / Deggendorf, Germany, March 11, 2025 * * * AMI®, the global leader in Dynamic Firmware for worldwide computing, and congatec, a leading provider of embedded and edge computing…
COMs just got even cooler
Unrivaled AI performance for COMs with Intel Core Ultra processors
Empowering smart factories: congatec highlights application-ready solution platforms
简化物联网连接：应用就绪型软件构建模块
低功耗 SMARC 模块AI 加速和图形处理性能再次提升
基于英特尔酷睿 Bartlett Lake S处理器的模块性能全面提升
From start-up to world leader in embedded computing technology
康佳特aReady.COM解决方案提供最佳的Ubuntu Pro 体验
A new level of application readiness - for increased efficiency and reliability
超紧凑计模块提供高达 39 TOPS AI 算力
康佳特模块为边缘AI应用的安全性树立新标杆
集成工业物联网(IIoT)功能创造附加价值
Focus on security (NIS-2) and sustainability with offline AI and modular design
通往定制高端 3.5 英寸系统的更快、更可持续的途径
