First COM-HPC and next-gen COM Express modules
11th Gen Intel® Core™ processors (Code name: Tiger Lake) with two great new design options on COM-HPC and COM Express
The first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC’s broader array of interfaces. OEMs will benefit from the substantial performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel® Core™ processors deliver to the high-end computing sector. Typical applications can be found in many high-end solutions, from embedded systems and edge computing nodes to network hubs, and local fog data centers to core network appliances, as well as ruggedized central cloud data centers for critical government applications.
The modules
- 11th Generation Intel® Core™
- Power- and size-optimized design
- Rugged soldered processor
- Industrial temperature support
- PCIe Gen 4
- 11th Generation Intel® Core™
- Extremely rugged with soldered memory
- Extended temperature range options
- IEC-60068 certified
- PCIe Gen 4
Videos
conga-TC570r - New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
Learn more about our 11th Gen Intel Core based Computer-on-Modules
Everything you need to know about COMs
Computer-on-Modules (COMs) power everything from robotics and medical devices to edge computing and smart mobility. But what makes them so versatile? And which standard is right for your needs? Explore the answers in our comprehensive guide to COMs.
Rugged Computer-on-Modules
congatec COM Express Type 6 modules with soldered memory for shock and vibration resistant applications.
