COM Express Type 6 Ecosystem
The most elaborated high-performance ecosystem for modular designs
Our COM Express Type 6 ecosystem is the ideal choice for the full range of embedded computing applications. Offering two different form factors, it provides designers with everything they need to build anything from powerful PLCs, HMIs and shop-floor systems, to high-end digital signage systems, and high-performance medical equipment. For applications that require more performance and higher bandwidth than COM Express can offer, developers should also evaluate our high-performance COM-HPC Client ecosystem.
Details about the COM Express Specification
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There are 1,000's of possible configurations of our products, and therefore every possible configuration may not be shown with this tool.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
If you don't find the configuration you require contact your congatec Sales representative for further assistance.
conga-TCR8
- Up to 8 Zen 4 cores
- AMD Radeon™ RDNA™ 3 Graphics
- AMD XDNA™ NPU
- Up to 128 GB RAM (optional with ECC)
- TDP Range from 15W to 54W
- Onboard NVMe™ SSD (option)
conga-TC700
- Intel® Core™ Ultra processors
- Up to 16 cores
- Up to 96 GB DDR5 with in-band ECC
- Built-in Intel® Arc™ GPU
- Integrated Intel® AI Boost NPU
conga-TC675r
- 13th Generation Intel® Core™
- Soldered memory
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TC675
- 13th Generation Intel® Core™
- Intel® Performance Hybrid Architecture
- Extended temperature range options
- Up to 14 cores
- PCIe Gen 4
conga-TS570
- 11th Generation Intel® Core™
- Performance-optimized design
- Up to 8 cores
- Extended temperature range options
- PCIe Gen 4
conga-TC570r
- 11th Generation Intel® Core™
- Extremely rugged with soldered memory
- Extended temperature range options
- IEC-60068 certified
- PCIe Gen 4
conga-TCV2
- AMD Embedded Ryzen V2000 processor series
- High-performance Zen 2 CPU & VEGA GPU
- Superior cost/performance ratio
- Up to 8 cores
- Wide TDP range from 10-54 W
conga-TCA7
- Intel Atom® x6000E, Intel® Pentium® and Celeron®
- Cost- and power-optimized design
- Up to 4 cores
- Extended temperature range options
- Supports TSN and TCC
conga-TC570
- 11th Generation Intel® Core™
- Compact design
- Up to 4 cores
- Extended temperature range options
- PCIe Gen 4
conga-TC370
- 8th Generation Intel® Core™ SOC processor
- Up to 4 cores at low-power TDP of 15W
- New Intel® Gen 9 HD Graphics
- Optional eMMC 5.1 on board mass storage
- COM Express Compact Type 6 module 95x95 mm²
conga-TS370
- 8th Generation Intel® Core™ and Xeon®
- Performance-optimized design
- Up to 6 cores
- Supports USB 3.1 Gen 2 (10 Gbit/sw)
- Up to 64 GB ECC memory
conga-TR4
- AMD Embedded Ryzen V1000 processor series
- High-performance Vega GPU
- Supports up to 4x 4k
- Up to 4 cores
- Wide TDP range down to 12 W
conga-TS175
- 7th Generation Intel® Core™ and Xeon®
- Performance-optimized design
- Up to 4 cores
- Up to 32 GB DDR4
- ECC support
conga-TC175
- 7th Generation Intel® Core™ and Celeron®
- Size-optimized design
- Low configurable power consumption (cTDP 7.5 W)
- Up to 2 cores
- Up to 32 GB DDR4 memory
conga-TCA5
- Intel Atom® x7-E, Intel® Pentium® and Celeron®
- Size-optimized design
- Low power consumption (12 W)
- Up to 4 cores
- Extended temperature range options
conga-TS170
- 6th Generation Intel® Core™ and Xeon®
- Performance-optimized design
- Up to 4 cores
- Up to 32 GB DDR4
- ECC support for Intel® Xeon®
conga-TC170
- 6th Generation Intel® Core™ and Celeron®
- Size-optimized design
- Low power consumption (TDP 15 W)
- Up to 2 cores
- Up to 32 GB DDR4 memory
conga-TEVAL3/COMe3.1
- Evaluation Carrier for COMe Type 6 modules
- Supports COMe Compact and Basic modules using connector Pinout Type 6
- Compliant to latest COMe Spec Rev. 3.1
conga-TEVAL/COMe 3.0
- Evaluation carrier board for COM Express Type 6
- 6x PCIe card slots for 25 lanes
- Supports 4x USB 3.1 Type A
- Compact size (294x244 mm)
- Schematics available on project basis
