conga-TEVAL3/COMe3.1
- Evaluation Carrier for COMe Type 6 modules
- Supports COMe Compact and Basic modules using connector Pinout Type 6
- Compliant to latest COMe Spec Rev. 3.1
conga-HPC/EVAL-Server
- Evaluation carrier board for Size D & E
- 7x PCIe connectors for 52 lanes
- 10 GbE RJ45 through module
- GbE RJ45 through ASPEED AST2600
conga-HPC/EVAL-Client
- Evaluation carrier board for sizes A, B, C
- 5x PCIe connectors for 48 lanes
- 2x MIPI Camera Serial Interface
- KR connector to connect LAN mezzanine cards
conga-X7EVAL
- Evaluation carrier board for COM Express Type 7
- 4x PCIe slots for 32 lanes
- 4x 10 Gigabit Ethernet SFP+
- BMC with VGA, iKVM, virtual storage
- Extended temperature options
conga-TEVAL/COMe 3.0
- Evaluation carrier board for COM Express Type 6
- 6x PCIe card slots for 25 lanes
- Supports 4x USB 3.1 Type A
- Compact size (294x244 mm)
- Schematics available on project basis
conga-MEVAL
- Evaluation carrier board for COM Express Type 10
- 2x PCIe card slots for 5 lanes
- Schematics available on project basis
conga-SEVAL
- Evaluation carrier board for SMARC
- Reference schematics on project basis
- For all Arm based SMARC modules
- 3x PCIe slots
- Executes complete SMARC I/O range
conga-QEVAL/Qseven 2.0
To achieve a quick start with Qseven congatec offers an evaluation carrier board, which routes all the Qseven® signals to standard interface connectors.
conga-HPC/3.5-Mini
- Compact Application Carrier for COM-HPC Mini Modules
- Scalable 3.5” motherboard
- Longevity by module concept
- Quick start for COM-HPC Mini designs
conga-HPC/uATX-Server
- Quick start for COM-HPC Server and Edge Computing
- Unparalleled feature density
- Industrial temperature support
- Scalable µATX carrier board
conga-HPC/uATX-Client
- Application carrier board for sizes A, B, C
- µATX form factor
- Application-ready layout
- Supports all defined COM-HPC Client I/Os
conga-SMC1/SMARC-x86
- Application-ready 3.5“ carrier
- For direct system roll-out or evaluation
- For all x86 based SMARC modules
- Executes complete SMARC I/O range
- Tailored cooling solutions available
conga-SMC1/SMARC-ARM
- Application-ready 3.5“ carrier
- For direct system roll-out or evaluation
- For all Arm based SMARC modules
- Executes complete SMARC I/O range
- Tailored cooling solutions available
conga-HPC/LEK
- LAN enabling kit (LEK) for COM-HPC Server
- Up to 100 GbE throughput
- Supports SFP28, QSFP28, 8xSFP+
- With Intel® C827-IM or Intel® XL827
conga-DP/HDMI 4k Adapter
- Converts DP++ to HDMI
- Supports HDMI 1.4b with up to 3.4 Gbps
- Supports DP 1.2 with up to 5.4 Gbps
- Supports resolutions of up to 4k
conga-Q7/MFG-Serial-Adapter
MFG-header adapter on the QEV2 baseboard for RS-232 console-communication with UMX6 / QMX6
conga-LDVI
- Converts LVDS to DVI-D
- Allows for dual DVI-D systems
